Polyimide (PI) ICP Etching for Failure Analysis

PI has applications can be used for Failure Analysis. It has excellent process repeatability and clean removal of a wide range of materials is possible, without lifting of metal tracks.

  PlasmaPro 133 Cobra380
Etch rate: >800nm/min (average)
Uniformity: < ± 6%
Selectivity to SiNx: > 5:1
Wafer size: Up to 300mm

These results are for indicative purposes only.
For a detailed process specification please contact your sales representative.