Compact open-load system for Atomic Layer Deposition (ALD)

The OpAL system introduces a unique open loaded thermal ALD tool with plasma option. It has a clear and easy upgrade route to plasma, providing both plasma and thermal ALD in a single compact tool.

Product features
  • Vapour draw or bubbling of up to four liquid or solid precursors
  • Can be fitted with a nitrogen purged glove box with sample entry load lock for dry environment
  • Easily removable inner chamber reduces chamber cleaning times
  • In-situ analytical options including spectroscopic ellipsometry linked into ALD control software
  • Small wafer pieces up to full 200mm wafers – equally suitable for academic and industry R&D
  • Cabinet can be fitted to extraction lines and has nitrogen purge for assured health and safety compliance
  • Pneumatic hoist for safe opening of chamber
  • Can be fitted with extraction hood or nitrogen purged glove box for health and safety compliance

Download the brochure...

ALD Brochure

Atomic layer deposition process solutions

PDF 1.07MB
Optoelectronic Devices brochure

Plasma Solutions for Optoelectronic Semiconductor Device Manufacture

PDF 1.48MB

OpAL Image Gallery

Related Process Techniques

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FlexAL ALD Tool

Remote plasma & thermal ALD in one flexible tool

Tool Support

Flexible Support Agreements

Flexible Support Agreements

Tailored Service Contracts: Choose options that suit you

Pre-Purchased Service Fund

Pre-Purchased Service Fund

Our Pre-Purchased Services Fund gives you 10% more spending power