Remote plasma & thermal ALD in one flexible tool

The FlexAL® systems provide a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma atomic layer deposition (ALD) processes and thermal ALD within a single ALD system.

Product features
  • Automated 200mm load lock for process flexibility
  • Maximum flexibility in the choice of materials & precursors
  • Low-temperature processes enabled by plasma ALD
  • Low damage maintained by the use of remote plasma
  • Controllable, repeatable processes via recipe-driven software interface
  • Ability to handle up to 200mm wafers
  • Integral glove box on precursor modules for in-situ change-over
  • Integral ports to allow the addition of in-situ ellipsometry measurement tools
  • Clusterable for vacuum transfer of substrates
  • Cassette to cassette handling increases throughput suitable for production
  • Hex handler with robot and 25 wafer cassette for 100mm, 150mm or 200mm wafers (no tools required to swap between wafers)
  • All configurations can be located entirely within the cleanroom or through-the-wall


Growth on SiO2/Si substratesThe FlexAL2D system provides ALD of 2D transition metal dichalcogenides (TMDCs) for nanodevice applications and offers a number of benefits for growth of 2D materials:

2D materials growth Robust ALD processes for 2D materials Tunable morphology
  • At CMOS compatible temperatures
  • With precise digital thickness control
  • Over a large area (200mm wafers)
  • Self-limiting ALD growth
  • MoS2:
    • Oxygen and carbon free (<2%)
    • High growth per cycle ~0.1 nm/cycle
    • Crystalline material above 300°C

Control over basal plane or edge plane orientation

  • Growth of ALD dielectrics & other ALD layers on 2D materials in one tool
    • Create advanced 2D device structures
  • RF substrate biasing option for film property control










Download the brochure...

ALD Brochure

Atomic layer deposition process solutions

PDF 1.07MB
Optoelectronic Devices brochure

Plasma Solutions for Optoelectronic Semiconductor Device Manufacture

PDF 1.48MB

Image Gallery

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