Remote plasma & thermal ALD in one flexible tool

The FlexAL® systems provide a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma atomic layer deposition (ALD) processes and thermal ALD within a single ALD system.

Product features
  • Remote plasma & thermal ALD in one flexible tool
  • Automated 200mm load lock for process flexibility
  • Maximum flexibility in the choice of materials and precursors
  • Low-temperature processes enabled by plasma ALD
  • Low damage maintained by the use of remote plasma
  • Controllable, repeatable processes via recipe-driven software interface
  • Ability to handle from small wafer pieces up to full 200mm wafers
  • Load-locked wafer entry for low particle count and short loading-to-process-start time
  • Integral glove box on precursor modules for in-situ change-over
  • Integral ports to allow the addition of in-situ ellipsometry measurement tools
  • May be integrated in cluster system with other process tools, including Oxford Instruments PlasmaPro 100 range of etch and deposition tools
  • Licensed technology from ASM International NV
  • Clusterable for vacuum transfer of substrates
  • Cassette to cassette handling increases throughput suitable for production
  • Hex handler with robot and 25 wafer cassette for 100mm, 150mm or 200mm wafers (no tools required to swap between wafers)
  • All configurations can be located entirely within the cleanroom or through-the-wall

Download the brochure...

ALD Brochure

Atomic layer deposition process solutions

PDF 1.07MB
Optoelectronic Devices brochure

Plasma Solutions for Optoelectronic Semiconductor Device Manufacture

PDF 1.48MB

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