The Ionfab®300 offers the flexibility to perform etch and/or deposition and maximising system utilisation.

System specifications can be closely tuned to applications, enabling faster and repeatable process results. The systems are scalable from R&D to batch production in one tool.

The Ion Beam range offers functionality in multiple modes:

  • Ion Beam Etching (IBE)
  • Reactive Ion Beam Etching (RIBE)
  • Reactive Ion Beam Deposition (RIBD)
  • Chemically Assisted Ion Beam Etching (CAIBE)
  • Ion Beam Sputter Deposition (IBSD)
  • Ion Assisted Sputter Deposition (IASD)

 

Downloads

Ionfab300 Brochure

Flexible tools for multiple applications

PDF 951KB
Optoelectronic Devices brochure

Plasma Solutions for Optoelectronic Semiconductor Device Manufacture

PDF 1.48MB

Substrate Handling

Flexibility in a single tool

  • Wafer handling options:
    • Load-lock
    • Cassette-to-cassette loading/unloading for batch production
  • Handles from small pieces, through 100 mm (4 inch), up to 200 mm (8 inch) wafers
  • Ability to clamp any shape, and design unique carrier plates
  • Clusterable with other process tools including Oxford Instruments’ PlasmaPro plasma etch, deposition and sputtering tools, and FlexAL atomic layer deposition (ALD) tool
  • Simple upgrade options to add etch and deposition sources

Ion Source

Ion Source

  • Leading ion source and grid set technology
  • Grids are designed to suit specific applications: high uniformity, high rate, & low energy
  • Specific deposition grid sets to suit multiple targets, offer superior utilisation of target material
  • A full range of etch source options up to 30cm
  • Dual beam configurations (etch plus deposition source) offer the possibility to add capping layer immediately after etch, without exposing the process chamber or wafer to atmosphere
  • Increased deposition rates by using etch source as a plasma radical source (IASD)

Process Control

Flexibility in a single tool

  • Tiltable substrate holder can be angled from -90° up to +65° (depending upon configuration)
  • Enables ‘blazed’ gratings
  • Allows sidewalls to be cleaned off or etched
  • Angle control of substrate relative to deposition target ensures excellent deposition uniformity

Platen rotation speed

  • Variable platen rotation speed enables deposition rate to be controlled specifically for the application
  • Standard and high speed platen options

Substrate cooling

  • Prevents degradation of substrate and devices structures/other materials already in place
  • Option for wafer backside cooling with He (turbo-pump) or Ar (cryo-pump)

Process monitoring

  • Etch endpoint monitoring by SIMS for multi-material applications
  • Deposition process monitoring
  • Crystal monitor (single or dual head)
  • Chamber gas identification, partial pressure control and leak checking via RGA

Applications

Typical applications include

  • IR detectors
  • CdHgTe (CMT) etch
  • VOx deposition and etch
  • Metal contact and track etch
  • Diffraction gratings
  • SiO2 ‘blazed’ etch
  • Spintronics and MRAM
  • AR and HR coatings for laser bars
  • Telecom filters
  • III-V photonics etching
  • Thin film magnetic hard disk heads (TFMH)

Ionfab 300 for High Quality Optical Coatings

Specifically developed for high quality optical applications

Including High Reflective and Anti Reflective Coatings, the Ionfab300 offers many features and benefits for optical coatings:

  • High speed 8” specimen holder fitted to the system
  • Option to use uniformity shields, offering improvements in layer uniformity
  • High deposition rate is achievable through the use of the 15cm ion source
  • Excellent refractive index results may be achieved with the use of an assist source
  • Option to use a white light optical monitor is available with our patented holder

 

Ionfab300Plus Image Gallery

Tool Support

Gas Pod

Gas Pod

Our upgraded gas pods have the capability of being able to incorporate extra gas lines, allowing the user great flexibility.

Glassman power supply

Glassman power supply

Glassman ion beam power supply upgrade

Hiden HMT RGA

Hiden HMT RGA

Unique dual mode RGA system upgrade

LogViewer Software

LogViewer Software

New datalogging software that allows realtime graphing and post run analysis

Turbomolecular Vacuum Pump

Turbomolecular Vacuum Pump

Turbomolecular Vacuum Pump Upgrade

X20 Control System

X20 Control System

X20 control system designed to replace the Blue RS232 PLC.