Flexibility in a single tool

  • Wafer handling options:
    • Load-lock
    • Cassette-to-cassette loading/unloading for batch production
  • Handles from small pieces, through 100 mm (4 inch), up to 200 mm (8 inch) wafers
  • Ability to clamp any shape, and design unique carrier plates
  • Clusterable with other process tools including Oxford Instruments’ PlasmaPro plasma etch, deposition and sputtering tools, and FlexAL atomic layer deposition (ALD) tool
  • Simple upgrade options to add etch and deposition sources
Congratulations to Dr Kate A. Ross for winning the 2018 Lee Osheroff Richardson (LOR) Science Prize for North and S… https://t.co/5GEVpMSy6K
5:11 PM - 20 Feb 18
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