Flexibility in a single tool

  • Wafer handling options:
    • Load-lock
    • Cassette-to-cassette loading/unloading for batch production
  • Handles from small pieces, through 100 mm (4 inch), up to 200 mm (8 inch) wafers
  • Ability to clamp any shape, and design unique carrier plates
  • Clusterable with other process tools including Oxford Instruments’ PlasmaPro plasma etch, deposition and sputtering tools, and FlexAL atomic layer deposition (ALD) tool
  • Simple upgrade options to add etch and deposition sources