Etch and deposition tools for wafer processing

  • The PlasmaPro 100 range of etch and deposition tools can be fitted with a variety of substrate electrodes enabling processes over a wide temperature range.
  • It is ideally suited to a number of markets including MEMS, HBLED, Sensors, Failure Analysis, Power Semiconductors, Nanotechnology, Photovoltaics and multi user facilities.

Products In This Group

PlasmaPro 100 RIE System

PlasmaPro 100 RIE System

Delivers anisotropic dry etching for an extensive range of processes

PlasmaPro 100 Cobra ICP Etch

PlasmaPro 100 Cobra ICP Etch

PlasmaPro 100 offers advanced plasma etch and deposition solutions on one platform with loadlock or cassette to cassette for RIE, ICP etch, ICP CVD and PECVD, upto 200mm single wafer platforms or multi-wafer batch capability.

PlasmaPro 100 ICPCVD System

PlasmaPro 100 ICPCVD System

Designed to produce high quality films with high density plasmas at low deposition pressures and temperatures.

PlasmaPro 100 PECVD System

PlasmaPro 100 PECVD System

Designed to produce excellent uniformity and high rate films, with control of film properties

PlasmaPro 100 Estrelas Deep Silicon Etch System

PlasmaPro 100 Estrelas Deep Silicon Etch System

Designed to give total flexibility for Deep Silicon Etch (DSiE) applications

PlasmaPro 100 Polaris

PlasmaPro 100 Polaris

Delivers fast etch rates uniformly on single wafers up to 200mm diameter

Nanofab

Nanofab

Controllable growth of nanotubes and nanowires with flexible temperature up to 1200°C

PlasmaPro 400

PlasmaPro 400

Magnetron sputtering process tool for Physical Vapour Deposition (PVD)