PP_100_Cobra.jpgHighly configurable inductively coupled plasma (ICP) Etching Systems

The Cobra® ICP etch sources produce a high density of reactive species at low pressure. Substrate DC bias is independently controlled by an RF generator, allowing control of ion energy according to process requirements.

Process chambers are available as standalone modules, with load locks or in cluster configurations on hexagonal or square transfer chambers.

Product features
  • Delivers reactive species to the substrate, with a uniform high conductance path through the chamber, allowing a high gas flow to be used while maintaining low pressure
  • Electrodes available for temperatures from -150ºC to +400ºC with helium backside cooling and a range mechanical clamp designs
  • Optimised hardware and control to deliver processes requiring fast process step switching, e.g. Bosch
  • Variable height electrode can utilise the 3-dimensional characteristics of the plasma and accommodate substrates up to 10mm thick at optimum height
  • Range of ICP source diameters; 65mm, 180mm and 300mm
  • 13.56 MHz driven substrate electrode
  • High conductance vacuum layout
  • In-situ chamber cleaning
  • High pumping capacity gives wide process pressure window
  • Solid state RF generators and close coupled matching networks ensures fast, consistent plasma matching
Options:
  • Electrostatic shielding delivers reduced ion damage and reduced capacitive coupling
  • Chamber wall heating and liners reduce cleaning requirements, and increases uptime
  • Electrostatic chuck
  • Endpoint detection by laser interferometry and/or optical emission spectroscopy can be fitted to enhance etch control

Processes

ICP Etching of the following materials can be acheived using the PlasmaPro 100 Cobra systems:

Images

PlasmaPro 100 Brochure

PlasmaPro 100 Brochure
Etch and deposition tools for wafer processing
PDF 1.79MB
Optoelectronic Devices brochure

Plasma Solutions for Optoelectronic Semiconductor Device Manufacture

PDF 1.48MB
Discrete Devices Brochure

Plasma Solutions for Discrete Semiconductor Device Manufacture

PDF 5.88MB

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Tool Support

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Dual CM Gauge Switching Upgrade for increased process flexibility

Gas Pod

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Our upgraded gas pods have the capability of being able to incorporate extra gas lines, allowing the user great flexibility.

LN2 Autochangeover

LN2 Autochangeover

An upgrade to our Cryo Tables

LogViewer Software

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New datalogging software that allows realtime graphing and post run analysis

Optical End Point Detectors

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Optical end point detection Upgrades for etch & deposition tools

Ionfab300-1-co

Soft Pump

Soft pump/Soft Vent feature upgrade for increased performance

TEOS Liquid Level Sensing

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Upgrade to existing TEOS liquid delivery modules

Turbomolecular Vacuum Pump

Turbomolecular Vacuum Pump

Turbomolecular Vacuum Pump Upgrade

Wide temperature range electrode

Wide temperature range electrode

Improvements to design incorporated in the new wide temperature range electrode

X20 Control System

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X20 control system designed to replace the Blue RS232 PLC.