Inductively Coupled Plasma Chemical Vapour Deposition (ICPCVD) System

The ICP CVD process module is designed to produce high quality films with high density plasmas at low deposition pressures and temperatures.

Process chambers are available as standalone modules, with load locks or in cluster configurations on hexagonal or square transfer chambers.

Product features
  • Excellent quality low damage films at reduced temperatures. Typical materials deposited include SiO2, Si3N4 and SiON, Si and SiC at substrate temperatures as low as 20ºC
  • ICP source sizes of 65mm, 180mm, 300mm
  • Electrodes available for temperature ranges from 20ºC to 400ºC
  • Patented ICP CVD gas distribution technology
  • In situ chamber cleaning with end-pointing
  • Options of single wafer/batch or cassette loading
  • Up to 200mm single wafer processing
  • Multi-wafer batch processing for 50mm to 100mm, including cassette loading of batch carrier plates
  • High conductance vacuum layout
  • Options of a 4- 8- or 12-line gas pod provides flexibility in processes and process gases
  • Solid state RF generator and close coupled matching network ensures fast, consistent plasma matching

Options:

  • Wall heating reduces chamber wall deposition
  • Helium backside cooling with mechanical clamping ensures uniform wafer temperatures & optimised film properties

Downloads

PlasmaPro 100 Brochure
Etch and deposition tools for wafer processing
PDF 1.79MB
Optoelectronic Devices brochure

Plasma Solutions for Optoelectronic Semiconductor Device Manufacture

PDF 1.48MB
Discrete Devices Brochure

Plasma Solutions for Discrete Semiconductor Device Manufacture

PDF 5.88MB

Processes

Inductively Coupled Plasma Chemical Vapour Deposition (ICPCVD) of the following materials
can be achieved using the PlasmaPro 100 ICPCVD tools:

Images

Related Process Techniques

ICP CVD

ICP CVD

Plasma deposition of high quality dielectric films at low temperature with low damage.

Related Tools

PlasmaPro 800 open load PECVD system

PlasmaPro 800 open load PECVD system

Large capacity open-loading process solutions for PECVD

PlasmaPro 80 ICPCVD system

PlasmaPro 80 ICPCVD system

PlasmaPro 80 Stratum ICPCVD system

PlasmaPro 100 PECVD System

PlasmaPro 100 PECVD System

Designed to produce excellent uniformity and high rate films, with control of film properties

Tool Support

Advanced Energy Paramount Generators

Advanced Energy Paramount Generators

Upgrade for superior performance

Automatic Pressure Control (APC)

Automatic Pressure Control (APC)

APC upgrade for fast and accurate pressure control

Comdel Generator

Comdel Generator

Comdel Generator upgrade for increased performance

Dry Pump N2 Standby Mode

Dry Pump N2 Standby Mode

Get the dry pump N2 standby mode upgrade to save energy & nitrogen

Dual CM Gauge Switching

Dual CM Gauge Switching

Dual CM Gauge Switching Upgrade for increased process flexibility

Gas Pod

Gas Pod

Our upgraded gas pods have the capability of being able to incorporate extra gas lines, allowing the user great flexibility.

LN2 Autochangeover

LN2 Autochangeover

An upgrade to our Cryo Tables

LogViewer Software

LogViewer Software

New datalogging software that allows realtime graphing and post run analysis

Optical End Point Detectors

Optical End Point Detectors

Optical end point detection Upgrades for etch & deposition tools

Ionfab300-1-co

Soft Pump

Soft pump/Soft Vent feature upgrade for increased performance

TEOS Liquid Level Sensing

TEOS Liquid Level Sensing

Upgrade to existing TEOS liquid delivery modules

Turbomolecular Vacuum Pump

Turbomolecular Vacuum Pump

Turbomolecular Vacuum Pump Upgrade

Wide temperature range electrode

Wide temperature range electrode

Improvements to design incorporated in the new wide temperature range electrode

X20 Control System

X20 Control System

X20 control system designed to replace the Blue RS232 PLC.